DocumentCode
1596879
Title
DNA Base Excision Repair Nanosystem Engineering: Model Development
Author
Sokhansanj, B.A.
Author_Institution
Sch. of Biomed. Eng., Drexel Univ., Philadelphia, PA
fYear
2005
fDate
6/27/1905 12:00:00 AM
Firstpage
7588
Lastpage
7590
Abstract
DNA base damage results from a combination of endogenous sources, (normal metabolism, increased metabolism due to obesity, stress from diseases such as arthritis and diabetes, and ischemia) and the environment (ingested toxins, ionizing radiation, etc.). If unrepaired DNA base damage can lead to diminished cell function, and potentially diseases and eventually mutations that lead to cancer. Sophisticated DNA repair mechanisms have evolved in all living cells to preserve the integrity of inherited genetic information and transcriptional control. Understanding a system like DNA repair is greatly enhanced by using engineering methods, in particular modeling interactions and using predictive simulation to analyze the impact of perturbations. We describe the use of such a "nanosystem engineering" approach to analyze the DNA base excision repair pathway in human cells, and use simulation to predict the impact of varying enzyme concentration on DNA repair capacity
Keywords
DNA; biochemistry; cancer; cellular biophysics; enzymes; genetics; molecular biophysics; nanobiotechnology; physiological models; DNA base excision repair nanosystem engineering; arthritis; cancer; diabetes; diminished cell function; diseases; enzyme concentration; human cells; inherited genetic information; ionizing radiation; ischemia; metabolism; mutations; obesity; perturbations; predictive simulation; stress; toxins; transcriptional control; Analytical models; Arthritis; Biochemistry; DNA; Diabetes; Diseases; Ionizing radiation; Ischemic pain; Predictive models; Stress; DNA repair; modeling and simulation; nanobioengineering; systems biology;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location
Shanghai
Print_ISBN
0-7803-8741-4
Type
conf
DOI
10.1109/IEMBS.2005.1616268
Filename
1616268
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