• DocumentCode
    1597380
  • Title

    Micromachined probes for deep-brain stimulation

  • Author

    Motta, Paulo S. ; Judy, Jack W.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    251
  • Lastpage
    254
  • Abstract
    Although deep-brain stimulation (DBS) can be used to eliminate the severe side effects of Parkinson´s disease (e.g., muscle tremors), it does not prevent neurodegeneration that leads to dementia or death. A combination of DBS and drug treatment might be capable of halting these degenerative processes by altering the response of neural tissue to drugs. In order to fully investigate this hypothesis, a comprehensive long-term stimulation study in an animal model is needed. We have designed, fabricated, and tested a novel micromachined probe that is able to accurately stimulate the subthalamic nucleus (STN) while minimizing damage to the surrounding tissue. The probe is coated with gold and insulated with silicon nitride for biocompatibility, has four platinum electrodes to provide a variety of stimulus patterns, and is formed in a novel 3-D plating process that results in a microwire-like geometry (i.e., smoothly tapering diameter) with a corresponding mechanically stable shank
  • Keywords
    bioelectric phenomena; biomedical electrodes; brain; electroplating; microelectrodes; micromachining; moulding; patient treatment; 3-D electroplating; Parkinson´s disease; animal model; biocompatibility; deep-brain stimulation; long-term stimulation; mechanically stable shank; microelectrode probes; microfabrication technique; micromachined probes; microwire-like geometry; plating mold; platinum electrodes; smoothly tapering diameter; subthalamic nucleus; Animals; Dementia; Drugs; Gold; Insulation; Muscles; Parkinson´s disease; Probes; Satellite broadcasting; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microtechnologies in Medicine & Biology 2nd Annual International IEEE-EMB Special Topic Conference on
  • Conference_Location
    Madison, WI
  • Print_ISBN
    0-7803-7480-0
  • Type

    conf

  • DOI
    10.1109/MMB.2002.1002324
  • Filename
    1002324