DocumentCode :
1597405
Title :
Performance and characterization of a 20 kV, contact face illuminated, silicon carbide photoconductive semiconductor switch for pulsed power applications
Author :
Mauch, Daniel L. ; Sullivan, William W. ; Bullick, Alan B. ; Neuber, Andreas A. ; Dickens, James C.
Author_Institution :
Center for Pulsed Power & Power Electron., Texas Tech Univ., Lubbock, TX, USA
fYear :
2013
Firstpage :
1
Lastpage :
1
Abstract :
A 20 kV, lateral geometry, contact face illuminated, silicon carbide (SiC) photoconductive semiconductor switch (PCSS) is presented. The SiC PCSS was fabricated from high purity semi-insulating, bulk 4H-SiC (12.7 mm × 12.7 mm × 0.35 mm), in a lateral geometry, (0.6 mm gap) with both the anode and cathode contacts located on the same face of the device. The device was illuminated with light from a tripled Nd:YAG laser (355 nm-7 ns FWHM) entering from the contact face. The device demonstrated sub-ohm on-state resistance for laser pulse energies in the mJ range, and micro-amp leakage currents at 20 kVdc in the off-state. Voltage hold-off and low leakage currents in the off state were achieved through high energy electron beam irradiation of the bulk material. The switch´s geometry and packaging are discussed, along with experimental switching and blocking characteristics.
Keywords :
electrical contacts; electron beam effects; leakage currents; neodymium; pulsed power switches; semiconductor switches; silicon compounds; solid lasers; wide band gap semiconductors; SiC; SiC PCSS; YAG:Nd; anode contacts; cathode contacts; contact face illuminated switch; high energy electron beam irradiation; laser pulse energy; lateral geometry; microamp leakage currents; photoconductive semiconductor switch; pulsed power applications; semiinsulating bulk 4H-SiC; silicon carbide; sub-ohm on-state resistance; tripled Nd:YAG laser; voltage 20 kV; voltage hold-off; Contacts; Face; Geometry; Leakage currents; Power electronics; Silicon carbide; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location :
San Francisco, CA
ISSN :
0730-9244
Type :
conf
DOI :
10.1109/PLASMA.2013.6635034
Filename :
6635034
Link To Document :
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