Thermal conductivity of reinforced composites for electrical applications

Thermal conductivity and resistance at interfaces plays a major role in the heat transfer through a material. The potential advantages and uses of submicron and micron sized fillers for thermal management in reinforced composites used in electrical insulation applications are investigated. The affect of filler material, size, concentration, and aspect ratio on the processing, thermal, mechanical, and electrical properties of reinforced epoxy laminates is determined. The affect of submicron filler on the matrix and fiber reinforced composite modulus and flexural strength is determined. The dielectric dissipation factor tangent δ and the permittivity ε_r of the composite are measured; a significant increase in tangent d is not desirable. Improvement in thermal properties of the resultant composite material with minimal change in the dielectric properties is reached.