DocumentCode
1597657
Title
Development of water-cooled heat sink for high-power IGBT inverter
Author
Han, Minsub ; Lee, Su-Dong ; Hong, Chanook ; Yang, Chun-Suk ; Kim, Kyung-Seo
Author_Institution
Dept. of Mech. Eng., Univ. of Incheon, Incheon
fYear
2007
Firstpage
295
Lastpage
299
Abstract
We present the development of a water-cooled heat sink that provides reliable thermal performance for high-power IGBT inverter. The development process comprises three stages. In the concept design, the thermal performances of two design proposals are considered. The thermal system of each design is particularly analyzed using the compact model. In the detailed design stage, specific dimensions of the heat sink are determined considering the design options under given external restrictions and the results from three-dimensional heat transfer analysis. The prototype of the resultant design is made and tested on the rig for final confirmation. We emphasize the relevant use of the thermal analysis on each stage and also discuss various practical issues involved.
Keywords
heat sinks; heat transfer; insulated gate bipolar transistors; invertors; power bipolar transistors; thermal analysis; high-power IGBT inverter; thermal analysis; thermal performances; thermal system design; three-dimensional heat transfer analysis; water-cooled heat sink; Coolants; Cooling; Heat engines; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Inverters; Multichip modules; Power system reliability; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics, 2007. ICPE '07. 7th Internatonal Conference on
Conference_Location
Daegu
Print_ISBN
978-1-4244-1871-8
Electronic_ISBN
978-1-4244-1872-5
Type
conf
DOI
10.1109/ICPE.2007.4692396
Filename
4692396
Link To Document