Title :
´QL´-a new thermoplastic ribbon die attach adhesive
Author :
Graham, William F. ; Sakiadis, Byron C. ; Schmitt, F.
Author_Institution :
E.I. Du Pont de Nemours & Co., Wilmington, DE, USA
Abstract :
Summary form only given. A thermoplastic ribbon die-attach adhesive, QL, has been developed. This adhesive is a family of thermoplastic polymers supplied in ribbon form, 1.5 mils thick, in widths of 50-500 mils. The product is available as the polymer alone, and as a filled polymer having various degrees of thermal and electrical conductivity. A detailed discussion of the performance, tensile and modulus properties, application parameters, and proposed bonding mechanism for QL ribbon die-attach adhesive is presented. A review of the processing conditions used on different automatic die-bonding machines using several chip sizes and different lead frames is also presented.<>
Keywords :
integrated circuit manufacture; microassembling; packaging; polymers; 1.5 mil; 50 to 500 mil; QL; application parameters; automatic die-bonding machines; bonding mechanism; chip sizes; electrical conductivity; filled polymer; lead frames; modulus properties; performance; processing conditions; review; ribbon form; tensile strength; thermal conductivity; thermoplastic polymers; thermoplastic ribbon die attach adhesive; unfilled polymer; Bonding; Consumer electronics; Electronics packaging; Microassembly; Polymers; Semiconductor materials; Thermal conductivity; Thermal stresses;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16163
