• DocumentCode
    1598073
  • Title

    Stress grading in integrated power modules

  • Author

    Duchesne, C. ; Mermet-Guyennet, M. ; Dutarde, E. ; Lebey, T. ; Dagdag, S.

  • Author_Institution
    Power Electronics Associated Research, Laboratory (PEARL), ALSTOM Transport, Rue du docteur Guinier - BP4, 65601 SEMEAC, France
  • fYear
    2007
  • Firstpage
    347
  • Lastpage
    351
  • Abstract
    Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
  • Keywords
    Conductivity; Copper; Electronics packaging; Metallization; Multichip modules; Permittivity; Power electronics; Semiconductor materials; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics, 2007. ICPE '07. 7th Internatonal Conference on
  • Conference_Location
    Daegu, South Korea
  • Print_ISBN
    978-1-4244-1871-8
  • Electronic_ISBN
    978-1-4244-1872-5
  • Type

    conf

  • DOI
    10.1109/ICPE.2007.4692407
  • Filename
    4692407
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1598073