Title :
Stress grading in integrated power modules
Author :
Duchesne, C. ; Mermet-Guyennet, M. ; Dutarde, E. ; Lebey, T. ; Dagdag, S.
Author_Institution :
Power Electronics Associated Research, Laboratory (PEARL), ALSTOM Transport, Rue du docteur Guinier - BP4, 65601 SEMEAC, France
Abstract :
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
Keywords :
Conductivity; Copper; Electronics packaging; Metallization; Multichip modules; Permittivity; Power electronics; Semiconductor materials; Stress; Voltage;
Conference_Titel :
Power Electronics, 2007. ICPE '07. 7th Internatonal Conference on
Conference_Location :
Daegu, South Korea
Print_ISBN :
978-1-4244-1871-8
Electronic_ISBN :
978-1-4244-1872-5
DOI :
10.1109/ICPE.2007.4692407
