• DocumentCode
    1598318
  • Title

    Evaluation of epoxy based nanodielectrics for high voltage outdoor insulation

  • Author

    Iyer, G. ; Gorur, R.S. ; Richert, R. ; Krivda, A. ; Schmidt, L.E.

  • Author_Institution
    Sch. of Electr., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Nano and micro based epoxy samples have been evaluated for predicting their electrical performance in outdoor high voltage insulation applications. Scanning electron microscopy (SEM) is used to evaluate the shape and the dispersion of the filler material. Space charge characterization and the role of the interface in these materials is evaluated using dielectric spectroscopy on these samples. The results of dielectric spectroscopy reveal the potential of improved electrical performance in terms of dielectric strength and tracking and erosion performance of the nano-filled samples as compared to the micro-filled counterparts. The uniform filler dispersion and the low loss tangent values have been used to theorize the improvement that can be expected from nano-composites in the field of outdoor insulation.
  • Keywords
    electric strength; epoxy insulation; nanocomposites; scanning electron microscopy; space charge; SEM; dielectric spectroscopy; dielectric strength; epoxy based nanodielectric evaluation; filler material dispersion; high voltage outdoor insulation; low loss tangent values; microbased epoxy; nanocomposites; scanning electron microscopy; space charge characterization; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electric potential; Electrochemical impedance spectroscopy; Insulation life; Scanning electron microscopy; Shape; Space charge; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-6298-8
  • Type

    conf

  • DOI
    10.1109/ELINSL.2010.5549743
  • Filename
    5549743