Title :
Micro/nano-sized diamond particles on Ni-columns for grinding application prepared by micro fabrication
Author :
Ching-Jui Shih ; Chia-Hung Yeh ; Lin, Wei-Chih ; Lin, Chao-Sung ; Chang, Wen-Chuan ; Yung-Ning Pan
Author_Institution :
Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
Micro/nano fabrication was employed in the fabrication of diamond conditioners. Diamond-nickel composite was utilized for fabricating columnar cutting tips and compared to those fabricated by the brazing connective approach. This technique can produce diamond conditioners with improved uniformity in both the distribution and protrusion control of Ni/diamond column array. The Ni/diamond column is efficient to share the applied load and also extends tool´s life during polishing. This approach has the potential to considerably integrate the nanofabrication process and assembly of nano-diamond particles on adaptive substrates, allowing for the grinding by local nano-diamond particles to form a uniform layer on a 3D integrated circuit (IC) chip.
Keywords :
assembling; brazing; composite materials; diamond; grinding; microfabrication; nanofabrication; polishing; three-dimensional integrated circuits; 3D integrated circuit chip; IC chip; Ni-C; adaptive substrates; brazing connective approach; columnar cutting tip fabrication; diamond column array; diamond conditioner fabrication; diamond-nickel composite; grinding application; local nanodiamond particles; microfabrication; microsized diamond particles; nanodiamond particle assembly; nanofabrication process; nanosized diamond particles; polishing; protrusion control; Diamond-like carbon; Fabrication; Force; Morphology; Nickel;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-4673-2198-3
DOI :
10.1109/NANO.2012.6322007