Title :
High frequency permeability of Fe-Al-Si granular composite materials
Author :
Tsutaoka, T. ; Ono, T. ; Tsurunaga, A. ; Kasagi, T. ; Hatakeyama, K. ; Koledintseva, M.Y.
Author_Institution :
Grad. Sch. of Educ., Hiroshima Univ., Hiroshima, Japan
Abstract :
High-frequency electromagnetic properties of Fe-Al-Si alloy (Sendust) granular composite materials have been studied by measuring their relative complex permeability (μr = μr\´ - j μr") and permittivity (εr = εr\´ - j εr") spectra. The bulk Fe-Al-Si alloy shows metallic electrical conduction, and permeability decreases rapidly with frequency. On the other hand, Sendust powder shows relatively high electrical resistivity. Sendust composite material demonstrates insulating electrical properties up to at least 80 vol.% particle content. Thus the relatively high permeability in the microwave frequency range can be obtained. Frequency dispersion characteristics of permeability for the composite were analyzed by the superposition of domain wall and gyromagnetic spin resonance formula. The particle content variation of permeability can be qualitatively described by a coherent model mixing rule.
Keywords :
aluminium alloys; composite materials; electrical conductivity; electrical resistivity; gyromagnetic effect; iron alloys; magnetic domain walls; magnetic particles; magnetic permeability; permittivity; powders; silicon alloys; Fe-Al-Si; Fe-Al-Si alloy granular composite materials; bulk Fe-Al-Si alloy; coherent model mixing rule; domain wall superposition; electrical resistivity; frequency dispersion characteristics; gyromagnetic spin resonance formula; high frequency permeability; high-frequency electromagnetic properties; insulating electrical properties; metallic electrical conduction; microwave frequency; particle content variation; permittivity spectra; relative complex permeability; sendust composite material; sendust powder; Composite materials; Conductivity; Dispersion; Ferrites; Metals; Permeability; Resonant frequency;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4577-0812-1
DOI :
10.1109/ISEMC.2011.6038288