Title :
Laminate based LED module with embedded MOSFET chips
Author :
Munding, A. ; Gruber, Martin ; Both, Thomas ; Carrillo, J. Mena ; Herfurth, M. ; Schmidt, Heidemarie ; Waldschik, A. ; Baur, E. ; Kaltenbacher, A. ; Hoge, M. ; Bergler, M.
Author_Institution :
Infineon Technol. AG, Regensburg, Germany
Abstract :
The AC power supply of an LED lighting system is usually a separate device which is typically several times bigger than the LED light source itself. We present a novel system integration approach that eliminates this separate device. In this novel approach we integrate the LED array and the power supply unit into one single module using a technology mix of laminate based chip embedding, surface-mount devices (SMD) and chip-on-board (CoB) technologies.
Keywords :
MOSFET; chip-on-board packaging; laminates; light emitting diodes; light sources; lighting; surface mount technology; AC power supply; CoB; LED array; LED light source; LED lighting system; SMD; chip-on-board technology; embedded MOSFET chips; laminate based LED module; laminate based chip embedding; power supply unit; surface-mount devices; system integration approach; Arrays; Assembly; Laminates; Light emitting diodes; Temperature measurement; Thermal conductivity;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962714
