Title :
I/O design considerations for multi-application circuits
Author :
Ruud, Troy L. ; Wright, John A.
Author_Institution :
AMI Semicond. Inc, Pocatello, ID, USA
fDate :
6/23/1905 12:00:00 AM
Abstract :
Pad design, the design of inputs and outputs of the integrated circuit that interface with the outside world, has increased in complexity multi-fold due to the increased variety of interfaces available today. This paper describes the creation of an I/O structure that is highly flexible in order to meet the needs of multivoltage and multi-swing circuits and which maintains common layouts suitable for gate array, standard cell and mixed signal designs
Keywords :
cellular arrays; circuit layout CAD; integrated circuit layout; integrated circuit reliability; logic CAD; logic arrays; mixed analogue-digital integrated circuits; I/O structure; common layouts; gate array; mixed signal designs; multi-swing circuits; multivoltage circuits; pad design; standard cell; Ambient intelligence; Bonding; Driver circuits; Flexible printed circuits; Libraries; Procurement; Signal design; Transceivers; Voltage; Wire;
Conference_Titel :
ASIC/SOC Conference, 2001. Proceedings. 14th Annual IEEE International
Conference_Location :
Arlington, VA
Print_ISBN :
0-7803-6741-3
DOI :
10.1109/ASIC.2001.954731
