A new embedded die package — WFOP™

Author

Takahashi, Tatsuro ; Inoue, H. ; Yada, Takahiro ; Hayashi, Neisei ; Imaizumi, Yukari ; Ikemoto, Yukiko ; Sawachi, Shigenori ; Furuno, Atsushi ; Yoshimitsu, Katsushi ; Ooida, Mitsuru ; Katsumata, Akio ; Hiruta, Yoichi

Author_Institution

J-DEVICES Corp., Yokohama, Japan

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

5

Abstract

A new package structure and technology for the next generation of embedded-die package named as WFOP™ (Wide panel Fan-Out Package) was developed. It´s a facedown mounting type, using metal plate as the base plate of its redistributed layer. Manufacturing is done not in wafer scale, but in large scale panel substrate. The structure, process, reliability results, and some performance are introduced. The package assembly technology for WFOP is using die-embedding method. So the technology is also able to apply to 3D packages. Some experience of 3D packages is shown in this paper. This technology will be expected to lead a new packaging technology for the next generation.

Keywords

electronics packaging; 3D packages; WFOP; assembly technology; base plate; embedded die package; facedown mounting type; large scale panel substrate; metal plate; redistributed layer; wide panel fan-out package; Assembly; Metals; Reliability; Resins; Thermal resistance; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962743

Filename

6962743