• DocumentCode
    1600090
  • Title

    Breakdown voltage of interelectrode gap between sphere-plane electrodes under ac voltage

  • Author

    Higashiyama, Masakazu ; Hayama, Tessai ; Nakamura, Shigenari ; Umemura, Tokihiro ; Hirose, Tatsuya ; Hikita, Masayuki ; Kozako, Masahiro

  • Author_Institution
    Toshiba Indsut. Products Manufact. Co., Asahi, Japan
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The breakdown voltage in a small spacing under dc voltage application has been well described with the Paschen law. The present paper differs from the previous works in that we employ ac voltage. The electrode system employed is sphere-plane electrodes and the sphere and/or sphere electrodes are coated with an epoxy resin. The breakdown voltage of air gap of the Metal (M) - Air gap (G) - M, MG-Epoxy layer (I), IGI electrode systems is measured using the advantage of the excited particles from the previous breakdown under a fast rate-of rise of ac voltage. It is found that the breakdown voltage decreases by employing the epoxy coating on electrode in the whole range of the production Pd from 0.3 to 90 Pa·m. In the range of the small product Pd from 0.3 to 5 Pa·m, the possibility of breakdown becomes high when the polarity of brass electrode is negative for MGI electrode system. It is concluded that the epoxy coated electrode decreases the breakdown of air and enhances electric field for the small spacing.
  • Keywords
    air gaps; electric breakdown; epoxy insulation; air gap; breakdown voltage; epoxy resin coating; interelectrode gap; sphere plane electrodes; Breakdown voltage; Circuits; Electric breakdown; Electrodes; Epoxy resins; Industrial power systems; Insulation; Noise measurement; Partial discharges; Vacuum systems; Paschen´s law; component; epoxy resin; partial discharge; partial discharge inception voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
  • Conference_Location
    San Diego, CA
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-6298-8
  • Type

    conf

  • DOI
    10.1109/ELINSL.2010.5549810
  • Filename
    5549810