DocumentCode :
1600090
Title :
Breakdown voltage of interelectrode gap between sphere-plane electrodes under ac voltage
Author :
Higashiyama, Masakazu ; Hayama, Tessai ; Nakamura, Shigenari ; Umemura, Tokihiro ; Hirose, Tatsuya ; Hikita, Masayuki ; Kozako, Masahiro
Author_Institution :
Toshiba Indsut. Products Manufact. Co., Asahi, Japan
fYear :
2010
Firstpage :
1
Lastpage :
4
Abstract :
The breakdown voltage in a small spacing under dc voltage application has been well described with the Paschen law. The present paper differs from the previous works in that we employ ac voltage. The electrode system employed is sphere-plane electrodes and the sphere and/or sphere electrodes are coated with an epoxy resin. The breakdown voltage of air gap of the Metal (M) - Air gap (G) - M, MG-Epoxy layer (I), IGI electrode systems is measured using the advantage of the excited particles from the previous breakdown under a fast rate-of rise of ac voltage. It is found that the breakdown voltage decreases by employing the epoxy coating on electrode in the whole range of the production Pd from 0.3 to 90 Pa·m. In the range of the small product Pd from 0.3 to 5 Pa·m, the possibility of breakdown becomes high when the polarity of brass electrode is negative for MGI electrode system. It is concluded that the epoxy coated electrode decreases the breakdown of air and enhances electric field for the small spacing.
Keywords :
air gaps; electric breakdown; epoxy insulation; air gap; breakdown voltage; epoxy resin coating; interelectrode gap; sphere plane electrodes; Breakdown voltage; Circuits; Electric breakdown; Electrodes; Epoxy resins; Industrial power systems; Insulation; Noise measurement; Partial discharges; Vacuum systems; Paschen´s law; component; epoxy resin; partial discharge; partial discharge inception voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on
Conference_Location :
San Diego, CA
ISSN :
1089-084X
Print_ISBN :
978-1-4244-6298-8
Type :
conf
DOI :
10.1109/ELINSL.2010.5549810
Filename :
5549810
Link To Document :
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