• DocumentCode
    1600440
  • Title

    Towards high-k integration with III-V channels: Interface optimization of high pressure sputtered gadolinium oxide on indium phospide

  • Author

    San Andres, E. ; Pampillon, M.A. ; Canadilla, C. ; Feijoo, P.C. ; del Prado, A.

  • Author_Institution
    Dept. de Fis. Aplic. III (Electr. y Electron.), Univ. Complutense de Madrid, Madrid, Spain
  • fYear
    2013
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    We studied the electrical properties of metal-oxide-semiconductor devices based on Gd2O3 deposited on InP by high pressure sputtering and a novel plasma oxidation process. The resulting devices show fully functional capacitance curves., indicating an unpinned Fermi level. The samples were annealed in forming gas at temperatures up to 550°C. We studied the interface trap density of the devices. We found out that with increasing annealing temperature the defect content decreases but at 550°C the capacitance drops and the leakage current increases., indicating a dielectric degradation.
  • Keywords
    Fermi level; III-V semiconductors; MIS devices; annealing; defect states; gadolinium compounds; high-k dielectric thin films; high-pressure effects; indium compounds; leakage currents; optimisation; plasma materials processing; sputter deposition; Gd2O3-InP; III-V channels; InP; annealing; defect content; dielectric degradation; electrical properties; forming gas; functional capacitance curves; high pressure sputtering; high-k integration; interface optimization; interface trap density; leakage current; metal-oxide-semiconductor devices; plasma oxidation; temperature 550 degC; unpinned Fermi level; Annealing; Capacitance; Frequency measurement; Indium phosphide; Logic gates; Plasma temperature; III-V; gadolinium oxide; high-k; indium phosphide; plasma oxidation; sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices (CDE), 2013 Spanish Conference on
  • Conference_Location
    Valladolid
  • Print_ISBN
    978-1-4673-4666-5
  • Electronic_ISBN
    978-1-4673-4667-2
  • Type

    conf

  • DOI
    10.1109/CDE.2013.6481333
  • Filename
    6481333