Reliability characterization of blind-hole vias for a System-in-Foil

Author

Lorenz, Enno ; Niemann, Nils ; Koyuncu, Metin ; Bock, Karlheinz

Author_Institution

Corp. Res., Robert Bosch GmbH, Waiblingen, Germany

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

6

Abstract

In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of real-time electrical measurements during bending. A significant improvement of the bending stability is achieved with the plasma treatment process, while the main failure mechanism for the non-plasma treated samples is delamination at the pad-adhesive interface.

Keywords

bending; circuit reliability; circuit stability; conductive adhesives; delamination; failure analysis; jets; printed circuit interconnections; printed circuit testing; thin film circuits; ICA; PCF interconnection; bending reliability characterization; bending stability; bending testing; blind-hole vias; delamination; failure mechanism; isotropic conductive adhesive; jet-dispense process; nonplasma treatment foil; oxygen plasma treatment; pad-adhesive interface; printed circuit foil interconnection; real-time electrical measurement; system-in-foil; Conductive adhesives; Filling; Materials; Plasmas; Reliability; Resistance; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962764

Filename

6962764