Correlations between process, material and quality characteristics and the reliability of solder joints

Author

Wohlrabe, Heinz ; Pantazica, Mihaela

Author_Institution

Centre of Microtechnical Production, Dresden Univ. of Technol., Dresden, Germany

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

6

Abstract

The reliability of solder joints is an important part of the quality of SMT-Boards. Accelerated reliability tests (e.g. thermal shock or others) are a possibility to test this important property. These tests are destroying tests. So it is not possible to use such tests for the characterization of the reliability of produced SMT-Boards. The IPC 610 E [1] contains a lot of quality characteristics with a deep correlation between the value of the characteristic and the reliability of the related solder joint. The measurement of such characteristics during the production of the boards enables a characterization of the reliability of the produced solder joints. The paper shows the results of some investigations and experiments performed to determine the dependencies between the measured quality characteristics and reliability.

Keywords

life testing; reliability; soldering; solders; surface mount technology; IPC 610 E; SMT-board quality characteristics; accelerated reliability testing; material characteristics; process characteristics; solder joint; thermal shock; Force; Geometry; Layout; Reliability; Soldering; Standards; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962792

Filename

6962792