Immobilization of metal coated polymer spheres on Indium pads

Author

Vinh Cao Duy ; Hoang-Vu Nguyen ; Kristiansen, Helge ; Taklo, Maaike M. V. ; Aasmundtveit, Knut E. ; Hoivik, Nils

Author_Institution

Dept. of Micro & Nanosyst. Technol., Buskerud & Vestfold Univ. Coll., Borre, Norway

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

5

Abstract

This paper investigates an approach for creating a metallurgic bond between Ø5 μm metal (Au)-coated polymer spheres (MPS) and Indium (In) pads. MPS were positioned onto In pads where the metal coating reacted with the In. The MPS were deposited by dry dispensing. The adhesion force between the MPS and the In pads was measured by acceleration/centrifugal testing. Under a centrifugal force of 34 nN, the percentage of remaining MPS increased from 10 % for samples without heat treatment to more than 90 % for samples exposed to 200 °C annealing. This is a strong indication that a metallurgic bond had formed between the metal coating on the MPS and the In on the pads.

Keywords

adhesive bonding; annealing; flip-chip devices; gold alloys; indium alloys; interconnections; polymer films; solders; Au-In; acceleration-centrifugal testing; adhesion force; annealing; centrifugal force; dry dispensing; flip-chip assembly; indium pads; metal coated polymer sphere immobilization; metallurgic bond; temperature 200 degC; Adhesives; Assembly; Force; Friction; Substrates; Surface treatment; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962800

Filename

6962800