Influence of curing conditions on mechanical properties and reliability of the interconnects made by ICA for printed electronics with micro additives

Conductive adhesives are widely used nowadays in electronic packaging eg. as a convenient way to connect chip on flexible substrate [1-3] such as Kapton foil, PEN foil, paper, thin epoxy laminate etc. Conductive adhesive mainly consist of organic polymer matrix and conductive fillers. Silver is widely the first choice as for its properties, electrical and thermal conductance and easy of producing the particles of different sizes and shapes. Silver is also beneficial because it´s not prone towards oxidation. The drawback of the printed electronics is its longevity, as during time they degrade, that´s why this technique is often used for simple assemblies such as RFID tags.