Title :
Investigations regarding variations of material properties and their impact on lifetime prediction for Cu-vias in circuit boards
Author :
Abali, B. Emek ; Lofink, Paul ; Muller, Wolfgang H.
Author_Institution :
Continuum Mech. & Mater. Theor., Tech. Univ. Berlin, Berlin, Germany
Abstract :
Copper vias in circuit boards fail working due to cracks caused by fatigue under thermal loading. This irreversible behavior is based on dissipation of plastic energy in the system leading to a steady increase in damage. This energy can be computed by using the finite element method. For improving the lifetime we investigate the material properties of copper and analyze their impact on lifetime prediction.
Keywords :
copper; fatigue cracks; finite element analysis; materials properties; plasticity; printed circuits; vias; Cu; circuit board failure; copper-vias; cracking; fatigue; finite element method; irreversible behavior; lifetime prediction; material property variation; plastic energy dissipation; thermal loading; Copper; Fatigue; Integrated circuit modeling; Loading; Plastics; Strain;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962811
