Title :
27th International Spring Seminar on Electronics Technology (IEEE Cat. No.04EX830)
Abstract :
The following topics are dealt with: embedded microcontroller system; impedance transducers; resistive bridge algorithms; inspection systems; electronics packaging; finite state machines; industrial control systems; information modelling; white light interferometry; multilayered circuitry; SMT defects; automation; PFC converter; lead free soldering; thick-film resistors; electromagnetic compatibility; radar automated control; timetabling problems; testing method; induction motor faults; semiconductor device simulation; V-I converters; biosensors; DSP technology; boost converters; wireless sensor networks; power line carrier applications; current steering DACs; PCB integrated waveguides; deep submicrometer CMOS; microstrip antenna array; ultrasonic bonding methods; three-phase active power filter; CAN controller; CW Doppler radar; stroboscopic device; eddy current losses; wireless data transmission; electronic device reliability; piezoelectric resonance sensor array; nanoscale devices; SPICE modeling of MOSFETs; three-dimensional topography simulation; scheduling optimization; printed circuit board production; electronic modules; planar transformers; 3D bent multilayer hybrid structures; reactive sputtering; S-parameters; CMOS core design; soldering processes; statistical process control; electrostatic discharge; thin film optical parameters; low power automotive interface; digital radio channels; genetic algorithms; education methods; active filters; photosensitive sensors; biopotential measurement system; sensing of position and acceleration; linear optical sensor; temperature measurement and regulation; FIR filter; lossy transmission lines; matrix semiconductor photoconverters; laser diode driver; electronic hardware design using VHDL; enterprise resource planning; operational amplifier circuits; differential predictive coding; force sensor; quality problem; university-industry network; mixed-signal systems; metal induced crystallization; nanoscale materials; p-ty
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Conference_Location :
Bankya, Bulgaria
Print_ISBN :
0-7803-8422-9
DOI :
10.1109/ISSE.2004.1490358