Title :
Full-wave EMC simulations using Maxwell Garnett model for composites with cylindrical inclusions
Author :
Nisanci, M.H. ; De Paulis, F. ; Koledintseva, M. ; Orlandi, A.
Author_Institution :
UAq EMC Lab., Univ. of L´Aquila, L´Aquila, Italy
Abstract :
Four different models for effective dielectric properties of biphasic composite containing random or aligned cylindrical inclusions are considered in this paper. These models are based on the Maxwell Garnett (MG) mixing rule. The effects of distribution and orientation of cylindrical inclusions in a composite material is studied. An equivalent averaged material with Debye-like frequency characteristics, suitable for time-domain full-wave numerical electromagnetic simulations is retrieved. This Debye model is derived from the Maxwell Garnett formulation. The numerical model test structure consists of a composite slab inserted in a rectangular waveguide. Simulations are run for the frequency range above the cut-off frequency of the fundamental mode TE10. The differences between the proposed models are quantified using the Feature Selection Validation (FSV) tool. The comparison of the models provides an insight on the effect of inclusion orientation and distribution.
Keywords :
Maxwell equations; composite materials; dielectric properties; electromagnetic compatibility; numerical analysis; Debye-like frequency characteristic; FSV tool; MG mixing rule; Maxwell Garnett mixing rule; aligned cylindrical inclusion; biphasic composite; composite material; composite slab; dielectric property; equivalent averaged material; feature selection validation tool; full-wave EMC simulation; rectangular waveguide; time-domain full-wave numerical electromagnetic simulation; Composite materials; Cutoff frequency; Electromagnetic waveguides; Electromagnetics; Numerical models; Permittivity; Composite materials; Debye dielectric model; Maxwell Garnett mixing rule; electromagnetic compatibility; feature selective validation;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4577-0812-1
DOI :
10.1109/ISEMC.2011.6038377