Abstract :
Presents the table of contents of the proceedings.
Keywords :
Application software; Environmentally friendly manufacturing techniques; Lead; Optical interferometry; Packaging; Rotors; Soldering; Surface-mount technology; Testing; Transducers;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Conference_Location :
Bankya, Bulgaria
Print_ISBN :
0-7803-8422-9
DOI :
10.1109/ISSE.2004.1490361
