• DocumentCode
    1601840
  • Title

    Improving Yield on RF-CMOS ICs

  • Author

    Herrera, Alfredo ; Jato, Yolanda

  • Author_Institution
    Dept. of Commun. Eng., Univ. de Cantabria, Santander, Spain
  • fYear
    2013
  • Firstpage
    237
  • Lastpage
    240
  • Abstract
    One of the industry sectors with the largest revenue in the telecommunication field is the wireless communications field. Wireless operators try to offer products that fulfill the user demands in terms of price, battery life and product quality. All these requirements must be also fulfilled by the designer of the MMIC (Microwave Monolithic Integrated Circuits) circuits that will be used in those wireless terminals, achieving a reliable design, with high performance, low cost and if possible in one or two foundry iterations so as to bring the product out to the market as soon as possible. Silicon based technologies are the lowest cost ones. These technologies don´t include some essential components for the design of RF circuits, which leads to measurement results quite different from those simulated. The deep study of the problems presented when designing Si based RF circuits recommends the use of electromagnetic simulation or coo-simulation tools. The paper shows different simulation techniques that help the designer to obtain better designs with a lower cost, as well as reduced foundry iterations.
  • Keywords
    CMOS integrated circuits; MMIC; circuit simulation; integrated circuit design; integrated circuit yield; radiofrequency integrated circuits; MMIC; RF circuits; RF-CMOS IC; Si; battery life; co-simulation tools; electromagnetic simulation; foundry iterations; microwave monolithic integrated circuits; product quality; silicon based technologies; telecommunication field; user demands; wireless communications field; wireless operators; wireless terminals; Electromagnetics; Impedance; Integrated circuit modeling; Layout; Microstrip; Radio frequency; Semiconductor device modeling; CMOS; EM-circuit cosimulation; Yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices (CDE), 2013 Spanish Conference on
  • Conference_Location
    Valladolid
  • Print_ISBN
    978-1-4673-4666-5
  • Electronic_ISBN
    978-1-4673-4667-2
  • Type

    conf

  • DOI
    10.1109/CDE.2013.6481386
  • Filename
    6481386