DocumentCode
160189
Title
Reflow process optimization for micro-bumps applications in 3D technology
Author
Derakhshandeh, J. ; De Preter, Inge ; England, Luke ; Schmid, Daniel ; Slabbekoorn, John ; Vakanas, George ; Teng Wang ; Beyer, G. ; Beyne, Eric ; Marinissen, Erik Jan ; Rebibis, Kenneth June ; Lerch, Wilfried ; Miller, Alice
Author_Institution
Imec, Heverlee, Belgium
fYear
2014
fDate
16-18 Sept. 2014
Firstpage
1
Lastpage
5
Abstract
In this paper a reflow process for fine-pitch micro-bumps is studied. A mathematical model for the reflow process is proposed and verified by experimental measurements. The influence of reflow profile parameters on the shape of micro-bumps, will be discussed using three commercial reflow ovens. Furthermore, measurement results of bump height variations after reflow over a 300mm wafer will be presented.
Keywords
circuit optimisation; fine-pitch technology; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; reflow soldering; three-dimensional integrated circuits; 3D technology; bump height variations; commercial reflow ovens; fine-pitch microbumps; mathematical model; reflow process optimization; reflow profile parameters; wafer; Inspection; Mathematical model; Nickel; Ovens; Shape; Stacking; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location
Helsinki
Type
conf
DOI
10.1109/ESTC.2014.6962837
Filename
6962837
Link To Document