DocumentCode :
1601912
Title :
How to adapt the electronics packaging teaching process to current needs -a perspective
Author :
Pitica, Dan ; Chindris, Gabriel
Author_Institution :
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Romania
Volume :
1
fYear :
2004
Firstpage :
20
Abstract :
The new higher learning educational system in Romanian Universities divided into three main stages of bachelor, master and doctoral degrees demands a new approach which must take into consideration the common ground of different higher learning systems, the specific characteristics of the pre-university learning system and the local particularities of the regional and national electronic industry´s environment. A classification of competencies required for the alumni in every stage of education, illustrating the very means of implementing these competencies at the level of electronic packaging education, is proposed. Statistical data results are presented from the training process of the 2002-2003 year of study, where the results were obtained by applying the proposed methods without an effective enrolment in the forthcoming new educational system.
Keywords :
educational institutions; electronic engineering education; electronics packaging; further education; bachelor degree; doctoral degree; electronics packaging teaching process; higher learning educational system; master degree; national electronic industry; pre-university learning system; regional electronic industry; Education; Educational institutions; Electrical capacitance tomography; Electronics packaging; Industrial training; Learning systems; Masers; Organizing; Space technology; World Wide Web;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Print_ISBN :
0-7803-8422-9
Type :
conf
DOI :
10.1109/ISSE.2004.1490369
Filename :
1490369
Link To Document :
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