Title :
White light interferometry, a method for optical 3D-inspection of advanced packages
Author :
Schaulin, M. ; Wolter, K.-J.
Author_Institution :
Electron. Packaging Lab., Dresden Univ. of Technol., Germany
Abstract :
White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.
Keywords :
electronics packaging; inspection; light interferometry; shape measurement; 3D surface shape measurement; advanced packages; area array components; electronics packaging technology; optical 3D-inspection; white light interferometry; Assembly; Components, packaging, and manufacturing technology; Interference; Microscopy; Mirrors; Optical interferometry; Optical scattering; Optical sensors; Semiconductor device packaging; Shape measurement;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Print_ISBN :
0-7803-8422-9
DOI :
10.1109/ISSE.2004.1490373
