Title :
Reduction of crosstalk in mixed CNT bundle interconnects for high frequency 3D ICs and SoCs
Author :
Sathyakam, P. Uma ; Karthikeyan, A. ; Rajesh, J. Kavish ; Mallick, P.S.
Author_Institution :
Sch. of Electr. Eng., VIT Univ., Vellore, India
Abstract :
This paper investigates the multi equivalent single conductor (MESC) model for mixed CNT bundles (MCBs) which contains metallic single and double walled CNTs at the core and semiconducting single walled CNTs at the periphery. This structure shows the least delay due to crosstalk.
Keywords :
carbon nanotubes; conductors (electric); crosstalk; system-on-chip; three-dimensional integrated circuits; MCBs; MESC model; SoCs; crosstalk reduction; delay; double walled CNTs; high frequency 3D ICs; metallic single CNTs; mixed CNT bundle interconnects; multiequivalent single conductor model; semiconducting single walled CNTs; Capacitance; Carbon nanotubes; Conductors; Crosstalk; Delays; Integrated circuit interconnections; Semiconductor device modeling; carbon nanotubes; crosstalk; interconnects; tunneling;
Conference_Titel :
Advances in Electrical Engineering (ICAEE), 2014 International Conference on
Conference_Location :
Vellore
DOI :
10.1109/ICAEE.2014.6838461
