Title :
Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper
Author :
Min-Su Kim ; Nishikawa, Hisashi
Author_Institution :
Joining & Welding Res. Inst., Osaka Univ., Ibaraki, Japan
Abstract :
We focus on the electroless nickel/immersion gold (ENIG) plating on a Cu disk and evaluate the initial characteristics of Ni(P) layer and the thermal stability of ENIG during the thermal storage test at 250°C in air condition. The initial plated Ni(P) contains about 6.5 wt.% phosphorus and shows the mixture of amorphous and small amount of nanocrystalline Ni. After the thermal storage up to 720 h at 250°C, the crystallization of Ni and phase transformation into Ni3P are detected.
Keywords :
copper; crystallisation; electroless deposited coatings; electroplating; gold; nickel; phase transformations; substrates; surface finishing; thermal stability; Cu; DBC substrate; ENIG plating; air condition; crystallization; direct bond copper; electroless nickel/immersion gold surface finish; nanocrystalline nickel; phase transformation; phosphorus; temperature 250 C; thermal stability; thermal storage test; Aging; Crystallization; Gold; Nickel; Surface finishing; Surface morphology; Thermal stability;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962845
