Title :
Packaging concept for a miniaturized wirelessly interrogable temperature logger
Author :
Mündlein, M. ; Nicolics, J. ; Brandl, M.
Author_Institution :
Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Austria
Abstract :
We present the packaging concept of a miniaturized, biocompatible temperature logger. In a first application, the device will be cast in the palate piece of a removable brace to observe the wearing habit of the patient. For this purpose the temperature is measured with a pn junction and recorded using a micro controller which acts as a temperature logger and is capable of storing the thermal history from several months. This device is hermetically sealed using polymeric encapsulants. The data exchange is carried out using a wireless interrogating transponder using radio frequency identification device (RFID) technology. The function principle of this data transfer technology is explained briefly. Due to the limited space in the brace, an extremely high level of miniaturization is necessary. To reach this goal, the device is built-up as a multichip module using a single sided FR4 printed circuit board with a line width of down to 35 μm. The entire prototype fabrication process, including details on miniaturization related difficulties, is described. Also, the paper describes the finding and evaluation of a biocompatible casting material as needed for a medical application. An easy way for the direct assessment of water absorption and its effect on the electrical function of the module is also presented.
Keywords :
biomedical materials; casting; data loggers; intelligent sensors; microcontrollers; multichip modules; patient monitoring; radio applications; temperature measurement; temperature sensors; FR4 printed circuit board; RFID technology; biocompatible casting material; biocompatible temperature; brace; data transfer technology; intelligent sensor; microcontroller; miniaturized temperature logger; miniaturized wirelessly interrogable temperature logger; multichip module; packaging concept; palate piece; pn junction; polymeric encapsulants; radio frequency identification device technology; thermal history; water absorption; wireless interrogating transponder; Hermetic seals; History; Multichip modules; Packaging; Polymers; Radiofrequency identification; Space technology; Temperature control; Temperature measurement; Transponders;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Print_ISBN :
0-7803-8422-9
DOI :
10.1109/ISSE.2004.1490378