Title :
Comparison between organic and ceramic substrate insulation
Author :
Bicakci, Aylin ; Eisele, Ronald ; Osterwald, Frank ; Olesen, Klaus
Author_Institution :
Univ. of Appl. Sci. Kiel, Kiel, Germany
Abstract :
A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.
Keywords :
ceramic insulation; conducting materials; electronics packaging; breakdown voltage; ceramic substrate insulation; die on leadframe-technology; organic electrically insulating layers; organic substrate insulation; power electronic packages; sheer strengths; test methods; thermal properties; thermally conductive layers; Ceramics; Copper; Substrates; Temperature measurement; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronics System-Integration Technology Conference (ESTC), 2014
Conference_Location :
Helsinki
DOI :
10.1109/ESTC.2014.6962859
