Title :
Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP
Author :
Chuen-De Wang ; Tzong-Lin Wu
Author_Institution :
Dept. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
A novel electromagnetic bandgap (EBG) structure is proposed to mitigate power noise in the power distribution network of RF SiP. In order to enhance the bandwidth of the suppression stopband, the proposed EBG structure is implemented by employing multi-layer printed circuit board and multiple power/ground via pairs with narrow pitch. The design concepts for the enhancement of the lower/upper bound cutoff frequency are investigated in this paper. Test boards are fabricated and measured to validate the accuracy of the design concepts. The measured results show good consistency with simulated ones. To demonstrate the influence of the power noise on RF SiP, a simulation environment including a 60 GHz power amplifier and power distribution network on the package level is established. Besides, the proposed EBG power/ground plane is employed to suppress the power noise and intermodulation distortion of the RF output spectrum.
Keywords :
interference suppression; microwave materials; millimetre wave power amplifiers; photonic band gap; printed circuits; system-in-package; RF SiP; bandwidth enhanced EBG structure; electromagnetic bandgap structure; multilayer printed circuit board; multiple power-ground via pair; power amplifier; power distribution network; power noise suppression; Bandwidth; Cutoff frequency; Metamaterials; Noise; Periodic structures; Power amplifiers; Radio frequency;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
978-1-4577-0812-1
DOI :
10.1109/ISEMC.2011.6038402
