DocumentCode
1602515
Title
Can intentional electrical discharges be used for HPM protection?
Author
Backstrom, M. ; Jordan, U. ; Andersson, Dag ; Kim, A.V. ; Lisak, M. ; Lunden, O.
Author_Institution
Combitech AB, Linköping, Sweden
fYear
2011
Firstpage
752
Lastpage
757
Abstract
The possibility to protect electronics against High Power Microwaves (HPM) using an intentional electrical discharge triggered by the HPM pulse has been investigated. The case considered is a resonant slot, located e.g. in an antenna array or in a Frequency Selective Surface (FSS). The reduction of the pulse energy transmitted through the slot is regarded to be the most important parameter of merit. Experimental and theoretical research showed that a spark in the middle of a 46.3 × 0.1 mm resonant slot, induced by the incident HPM-pulse, gave a reduction of the transmitted pulse energy of about 24 dB. The studies showed that the investigated approach can provide a quite good level of protection that at least reduces the requirements on additional protection components such as limiters integrated in receivers located behind the slot. In order to achieve a sufficiently strong enhancement of the electric field to initiate breakdown in wide slots one presumably has to introduce a small pointed gap in the middle of the slot. This may in turn require that a radioactive sample is located close to the gap in order to produce a sufficient number of seed electrons necessary for triggering the discharge.
Keywords
discharges (electric); frequency selective surfaces; slot antenna arrays; antenna array; electric field enhancement; electrical discharges; electronics; frequency selective surface; high power microwaves protection; limiters; pulse energy reduction; receivers; seed electrons; Apertures; Damping; Discharges; Electric fields; Magnetic domains; Microwave theory and techniques;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location
Long Beach, CA, USA
ISSN
2158-110X
Print_ISBN
978-1-4577-0812-1
Type
conf
DOI
10.1109/ISEMC.2011.6038409
Filename
6038409
Link To Document