• DocumentCode
    1602520
  • Title

    New 3DP Process Technique of SFF System Using a Photopolymer Resin and a Powder

  • Author

    Kim, Jung-Su ; Lee, Min-Cheol ; Lee, Won-Hee ; Kim, Dong-Soo

  • Author_Institution
    Dept. of Mech. & Intelligent Syst. Eng., Pusan Nat. Univ.
  • fYear
    2006
  • Firstpage
    3688
  • Lastpage
    3691
  • Abstract
    SFF system could quickly makes models and prototype parts from 3D computer-aided design (CAD) data. SFF system in the office environment is a tool that streamlines and expedites the product development process. The 3DP technology is one of SFF(solid freeform fabrication) technologies which have recently came into the spotlight and are being applied to various fields. This process has the advantage of the fast manufacture time. But conventional 3DP process needs the post-process necessarily and a part fabricated by this process has too low strength. So we proposed a new 3DP process to reduce post-process time and fabricate a part with high strength and construct a SFF system. In this study, we constructed the SFF system using a photopolymer resin and a powder. We used the piezo printhead for the printing of the UV resin on the slice contour and experimented the curing of photopolymer resin in the powder based 3DP system
  • Keywords
    CAD; curing; optical polymers; powder technology; product development; resins; three-dimensional printing; 3D computer-aided design; 3DP process technique; CAD; UV resin; curing; office environment; photopolymer resin; piezo printhead; powder-based solid freeform fabrication system; product development process; Costs; Cranium; Design automation; Fabrication; Manufacturing processes; Powders; Printing; Product development; Prototypes; Resins; 3DP(Three Dimensional Printing); Piezo; SFF(Solid Freeform Fabrication); UV(Ultra Violet);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SICE-ICASE, 2006. International Joint Conference
  • Conference_Location
    Busan
  • Print_ISBN
    89-950038-4-7
  • Electronic_ISBN
    89-950038-5-5
  • Type

    conf

  • DOI
    10.1109/SICE.2006.315018
  • Filename
    4108404