• DocumentCode
    1603034
  • Title

    Notice of Retraction
    The Numerical Analysis on the Weld-Bonded Joints with Bi-adhesive

  • Author

    Min You ; Jialing Yan ; Xiaoling Zheng ; Dingfeng Zhu ; Jianli Li ; Jingrong Hu

  • Author_Institution
    Hubei Key Lab. of Hydroelectric Machinery Design & Maintenance, China Three Gorges Univ., Yichang, China
  • Volume
    4
  • fYear
    2010
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    The effect of bi-adhesive on the stress distribution in aluminum alloy weld-bonded single lap joint was investigated using elasto-plastic finite element method (FEM). The results from the numerical analysis show that the influence is evidently to the stress distributed along the mid-bondline, especially to the side of nugget near the low elastic modulus of adhesive as well as at the end of overlap zone. The longitudinal stress Sy, shear stress Sxy and von Mises equivalent stress Seqv increase significantly in the nugget and the adhesive with lower elastic modulus while the peak stress in the adhesive layer near the end of the overlap decreased gradually. The effect of bi-adhesive on the stress distribution in the adherend near the interface is similar to that in the mid-bondline of the adhesive layer. It is suitable to use bi-adhesives to improve the load bearing capacity.
  • Keywords
    adhesion; elastic moduli; elastoplasticity; finite element analysis; stress analysis; welding; FEA; adherends; bi-adhesive; elastic modulus; elasto-plastic finite element method; load bearing capacity; numerical analysis; stress distribution; von Mises equivalent stress; weld-bonded single lap joint; Aluminum alloys; Analytical models; Bonding; Computational modeling; Distributed computing; Finite element methods; Joining materials; Numerical analysis; Stress; Welding; FEA; aluminum alloy; bi-adhesives; stress distribution; weld-bonded joint;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Modeling and Simulation, 2010. ICCMS '10. Second International Conference on
  • Conference_Location
    Sanya, Hainan
  • Print_ISBN
    978-1-4244-5642-0
  • Type

    conf

  • DOI
    10.1109/ICCMS.2010.252
  • Filename
    5421528