DocumentCode :
1603034
Title :
Notice of Retraction
The Numerical Analysis on the Weld-Bonded Joints with Bi-adhesive
Author :
Min You ; Jialing Yan ; Xiaoling Zheng ; Dingfeng Zhu ; Jianli Li ; Jingrong Hu
Author_Institution :
Hubei Key Lab. of Hydroelectric Machinery Design & Maintenance, China Three Gorges Univ., Yichang, China
Volume :
4
fYear :
2010
Firstpage :
25
Lastpage :
28
Abstract :
Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

The effect of bi-adhesive on the stress distribution in aluminum alloy weld-bonded single lap joint was investigated using elasto-plastic finite element method (FEM). The results from the numerical analysis show that the influence is evidently to the stress distributed along the mid-bondline, especially to the side of nugget near the low elastic modulus of adhesive as well as at the end of overlap zone. The longitudinal stress Sy, shear stress Sxy and von Mises equivalent stress Seqv increase significantly in the nugget and the adhesive with lower elastic modulus while the peak stress in the adhesive layer near the end of the overlap decreased gradually. The effect of bi-adhesive on the stress distribution in the adherend near the interface is similar to that in the mid-bondline of the adhesive layer. It is suitable to use bi-adhesives to improve the load bearing capacity.
Keywords :
adhesion; elastic moduli; elastoplasticity; finite element analysis; stress analysis; welding; FEA; adherends; bi-adhesive; elastic modulus; elasto-plastic finite element method; load bearing capacity; numerical analysis; stress distribution; von Mises equivalent stress; weld-bonded single lap joint; Aluminum alloys; Analytical models; Bonding; Computational modeling; Distributed computing; Finite element methods; Joining materials; Numerical analysis; Stress; Welding; FEA; aluminum alloy; bi-adhesives; stress distribution; weld-bonded joint;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Modeling and Simulation, 2010. ICCMS '10. Second International Conference on
Conference_Location :
Sanya, Hainan
Print_ISBN :
978-1-4244-5642-0
Type :
conf
DOI :
10.1109/ICCMS.2010.252
Filename :
5421528
Link To Document :
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