DocumentCode :
1603040
Title :
Fluidic simulation and realization for inkjet nano SFIL
Author :
Liu, Chia Hsing ; Sung, Cheng Kuo ; Lo, Cheng Yao
Author_Institution :
Power Mech. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2012
Firstpage :
1
Lastpage :
5
Abstract :
This paper proposed an ultraviolet (UV) nanoimprinting process for transferring various macro/nano-scales patterns from a silicon mold to a polyethylene terephthalate (PET) substrate. Both finite element method (FEM) simulation and experiment were conducted to investigate the formation of patterns. A FEM model of periodic nanostructures with prescribed boundary conditions was first established. Then, the geometrical parameters, such as aspect ratio, duty ratio, and process parameters including velocity, UV curing time, the performance index, and the filling factor, were defined. From the simulated pressure and velocity distributions of the UV resin flow, the mechanism of the UV resin formation was obtained, which provided a guideline for performing the experimental study. The process parameters were tuned according to the simulation conditions and physical observations confirmed the geometries of the mold and the transferred patterns. This is a study concerning fluid-to-solid thermal nano-scale step and flash imprint lithography (SFIL) patterning with simulation prediction and process realization.
Keywords :
curing; elemental semiconductors; finite element analysis; ink jet printing; nanolithography; nanostructured materials; polymers; silicon; FEM model; Si; UV curing time; UV resin flow; UV resin formation; filling factor; finite element method simulation; flash imprint lithography patterning; flash imprint lithography process; fluid-solid thermal nanoscale step; fluidic simulation; geometrical parameter; inkjet nanoSFIL; macroscale pattern; nanoscale pattern; periodic nanostructure; polyethylene terephthalate substrate; silicon mold; step imprint lithography process; ultraviolet nanoimprinting process; Atmospheric measurements; Biological system modeling; Numerical models; Printing; Resins; Resists; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on
Conference_Location :
Birmingham
ISSN :
1944-9399
Print_ISBN :
978-1-4673-2198-3
Type :
conf
DOI :
10.1109/NANO.2012.6322147
Filename :
6322147
Link To Document :
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