DocumentCode :
1603071
Title :
Creation of nanoelectronic devices by focussed ion beam implantation
Author :
Koch, J. ; Grün, K. ; Ruff, M. ; Wernhardt, R. ; Wieck, A.D.
Author_Institution :
Fac. of Phys. & Astron., Ruhr-Univ., Bochum, Germany
Volume :
1
fYear :
1999
fDate :
6/21/1905 12:00:00 AM
Firstpage :
35
Abstract :
In contrast to the fabrication of integrated circuits by current photolithography, a direct exposure of ions is proposed. This can be done by the very flexible means of focussed ion beam technology or by the more throughput-oriented ion beam projection. The applicability of the proposed ion beam implantation is demonstrated by prototypes of field-effect transistors, ohmic and active loads and the potential ability of arbitrarily implanted ion beam patterns. This was demonstrated to be feasible both on GaAs and on Si
Keywords :
focused ion beam technology; gallium arsenide; integrated circuit manufacture; integrated circuit technology; ion implantation; nanotechnology; silicon; 10 nm; FIB technology; GaAs; IC fabrication; Si; focussed ion beam implantation; integrated circuits; ion beam projection; nanoelectronic devices; Contamination; Electron beams; Ion beams; Lithography; Nanoscale devices; Physics; Resists; Solids; Throughput; Writing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5735-3
Type :
conf
DOI :
10.1109/IECON.1999.822165
Filename :
822165
Link To Document :
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