Reliability tests of ultrasonic bonding methods using HAST and THB technology

Reliability is one of the most important questions in any application, on both the package (component) and the board (system) levels. The paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters. It gives a detailed description of the most effective and economical HAST (highly accelerated stress test) and THB (temperature humidity and bias) methods. The paper presents some new results of using HAST and THB technology for the following fields of reliability and life time tests: reliability analysis of assembled SMD passive components; water addition speed tests. Finally, the paper particularly deals with ultrasonic bonding technology, the bonding and testing machines. It introduces some measurement test results on the bonding force before and after a HAST and THB test.