DocumentCode :
1603330
Title :
Minimizing the number of basis functions in chip-package co-simulation using lauerre-FDTD
Author :
Myunghyun Ha ; Swaminathan, M.
Author_Institution :
Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2011
Firstpage :
905
Lastpage :
909
Abstract :
Interaction between the chip and package at the system level needs to be predicted in the design process for saving time and cost, which requires chip-package co-simulation. Laguerre-FDTD is an unconditionally stable FDTD scheme which is attractive for chip-package co-simulation since its time-step is not limited by the Courant condition. In Laguerre-FDTD, the transient waveform of the field of interest is represented as the weighted sum of Laguerre basis functions. Therefore, the number of basis functions used in the simulation is directly related to both the simulation run time and the accuracy. Normally, there is a tradeoff between simulation run time and the accuracy. However, this paper proposes a novel solution to minimize the number of basis functions while increasing the accuracy of the output transient waveform of interest. The method for maximizing the efficiency in terms of run time and improving the accuracy of simulation described in this paper is a key step for the automation and practical use of the transient simulation technique using Laguerre polynomials.
Keywords :
chip scale packaging; finite difference time-domain analysis; polynomials; stochastic processes; Courant condition; Laguerre basis functions; Laguerre polynomials; Laguerre-FDTD; chip-package co-simulation; transient simulation technique; transient waveform; Accuracy; Filtering; Finite difference methods; Integrated circuit modeling; Oscillators; Time domain analysis; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
ISSN :
2158-110X
Print_ISBN :
978-1-4577-0812-1
Type :
conf
DOI :
10.1109/ISEMC.2011.6038437
Filename :
6038437
Link To Document :
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