Stiffness of PQFP ´gull-wing´ lead and its effect on solder joint reliability

Author

Lau, John H. ; Harkins, C.G.

Author_Institution

Hewlett-Packard Lab., Palo Alto, CA, USA

fYear

1988

Firstpage

131

Lastpage

142

Abstract

A 12*12 stiffness matrix of the gull-wing lead and solder joint in a plastic quad flat pack (PQFP) surface-mount assembly was obtained by using a three-dimensional finite-element method. Deformation of the composite structure for each imposed unit displacement (or rotation) then obtained. The whole-field stress distributions in the gull-wing and solder joint provide a better understanding of their characteristics. The results presented herein can provide guidelines for the design of PQFP gull-wing leads and solder-joint reliability.<>

Keywords

finite element analysis; packaging; printed circuit manufacture; reliability; soldering; surface mount technology; FEA; PQFP; PQFP gull-wing leads; design guidelines; plastic quad flat pack; solder joint reliability; stiffness matrix; surface-mount assembly; three-dimensional finite-element method; whole-field stress distributions; Assembly; Electronics packaging; Finite element methods; Lead; Manufacturing; Sliding mode control; Soldering; Surface-mount technology; Thermal stresses; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16165

Filename

16165