• DocumentCode
    1603619
  • Title

    Some aspects of crosstalk for different electronic modules

  • Author

    Golumbeanu, Virgil ; Svasta, Paul ; Ionescu, Ciprlan ; Mackabinski, Romina ; Davidescu, Mircea

  • Author_Institution
    Dept. of Electron. Technol., Politehnica Univ. Bucharest, Romania
  • Volume
    2
  • fYear
    2004
  • Firstpage
    287
  • Abstract
    In the paper we analyzed the crosstalk for different electronic modules, and for this we computed, simulated and measured the crosstalk voltage for different situations. For evaluation of crosstalk, different experimental electronic modules are realized: double layer realized in classical technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); with different types of digital circuits (TTL, S, LS, HCT, HC, AC); and with different methods for reduction of crosstalk.
  • Keywords
    circuit simulation; crosstalk; digital circuits; integrated circuit packaging; laminates; modules; printed circuit design; printed circuits; AC digital circuits; Al; FELA laminates; FR4 substrate; HC digital circuits; HCT digital circuits; LS digital circuits; S digital circuits; TTL digital circuits; base metal; crosstalk reduction; crosstalk voltage; dielectric substrate; dielectric thin sheet; digital circuits; double layer modules; electronic module crosstalk; glass base; measurement; simulation; solid aluminum conductive substrate; trace layer; Aluminum; Analytical models; Computational modeling; Crosstalk; Dielectric measurements; Dielectric substrates; Digital circuits; Glass; Laminates; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
  • Print_ISBN
    0-7803-8422-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2004.1490436
  • Filename
    1490436