Evaluation of equipment capability for precision placing of electronic components by using SPC (statistical process control)

Author

Tsenev, Valentin ; Petrova, Irina

Author_Institution

Industriaha zona Microelectron., EPIQ EA Ltd., Botevgrad, Bulgaria

Volume

2

fYear

2004

Firstpage

342

Abstract

SPC control is a statistical method for evaluating whether a process is under control and is capable. It has been developed on the basis of comprehensive mathematical statistical methods and it is already largely used for process improvement in the discrete electronic industry. This report describes an SPC study of capabilities for precise and stable placing of electronic components on printed circuit boards. Predictions and real results are presented for a specific assembly machine.

Keywords

assembling; printed circuit manufacture; process capability analysis; statistical process control; PCB component placement; SPC; assembling equipment capability evaluation; assembly machine; electronic component precision placement; process improvement; statistical mathematical methods; statistical process control; Assembly; Control charts; Electronic components; Electronics industry; Electronics packaging; Machinery; Printed circuits; Process control; Production; Statistics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on

Print_ISBN

0-7803-8422-9

Type

conf

DOI

10.1109/ISSE.2004.1490448

Filename

1490448