DocumentCode
1603994
Title
Mechanical testing of thin films
Author
Vinci, R.P. ; Bravman, J.C.
Author_Institution
Dept. of Mater. Sci. & Eng., Stanford Univ., CA, USA
fYear
1991
Firstpage
943
Lastpage
948
Abstract
The authors briefly discuss standard testing methods for thin films and compare them with a number of newer techniques. Basic material considerations in thin film stresses and deformation are summarized. Finally, microcantilever beam bending and wafer curvature experiments are presented as representative of recent work in mechanical testing of thin films.<>
Keywords
materials testing; mechanical testing; stress measurement; thin films; deformation; mechanical testing; microcantilever beam bending; micromechanical device films; standard testing methods; stresses; thin films; wafer curvature; Dielectric thin films; Mechanical factors; Microelectronics; Optical films; Sputtering; Substrates; Temperature; Testing; Thermal stresses; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-87942-585-7
Type
conf
DOI
10.1109/SENSOR.1991.149045
Filename
149045
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