3D nanofabrication of components by repeated corner lithography: Self aligned sub-50nm apertures

Repeated corner lithography is an innovative method in wafer scale to obtain three dimensional nano structures, which are uniform and compatible with geometrical expectation. In this paper we present novel sub-50nm apertures fabricated by repeated corner lithography. An important result from the presented work is that it is possible to control the aperture size and feature by initial layer thickness of nitride and proper choice of LOCOS temperature and oxidation time.