Title :
Metallization of a polymer substrate for microfluidic-cooled RF laminates
Author :
Long, Shipeng ; Dorsey, W. Mark ; Adams, Albert A. ; Huff, Greg
Author_Institution :
Radar Div., U.S. Naval Res. Lab., Washington, DC, USA
Abstract :
A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.
Keywords :
UHF integrated circuits; cooling; embossing; integrated circuit metallisation; integrated circuit packaging; laminates; microfabrication; microfluidics; microwave integrated circuits; polymers; PMMA; RF devices; cooling; copper mesh; frequency 2.916 GHz; hot-embossing; integrated circuits; microfluidic channels; microfluidic-cooled RF laminates; microstrip patch antenna; microwave laminate; poly(methyl methacrylate); polymer substrate metallization; resonant frequency; Integrated circuits; Laminates; Metallization; Microfluidics; Polymers; Radio frequency; Substrates; PMMA; acrylic; copper mesh; polymer;
Conference_Titel :
IC Design & Technology (ICICDT), 2014 IEEE International Conference on
Conference_Location :
Austin, TX
DOI :
10.1109/ICICDT.2014.6838591
