DocumentCode
160434
Title
Design layout optimization in the presence of proximity-dependent stress effects
Author
Sultan, Ahmed ; Ramzan, Rashad ; Wristers, Derick
Author_Institution
Dept. of Electr. Eng., United Arab Emirates Univ., Al Ain, United Arab Emirates
fYear
2014
fDate
28-30 May 2014
Firstpage
1
Lastpage
4
Abstract
In this paper, we present Minimized Layout Effect (MINLAYEF) guidelines for reducing the layout and process variations in critical analog circuits. We also present digital design guidelines to minimize the effect of process variations by eliminating stress sources. We also propose a layout for a reference device for a dual stress liner (DSL) device architecture to improve the accuracy of simulations. Si results from circuit layout designed with and without layout guidelines are also presented.
Keywords
analogue circuits; circuit optimisation; elemental semiconductors; integrated circuit layout; proximity effect (lithography); silicon; stress effects; DSL device architecture; MINLAYEF guidelines; Si; circuit layout; critical analog circuits; design layout optimization; digital design guidelines; dual stress liner device architecture; minimized layout effect; process variation effect; proximity-dependent stress effects; stress source elimination; DSL; Degradation; Fingers; Guidelines; Layout; MOS devices; Stress; DSL; Layout guidelines; Stress proximity effects;
fLanguage
English
Publisher
ieee
Conference_Titel
IC Design & Technology (ICICDT), 2014 IEEE International Conference on
Conference_Location
Austin, TX
Type
conf
DOI
10.1109/ICICDT.2014.6838594
Filename
6838594
Link To Document