Design and modeling of a micromechanical surface bonding system

Author

Han, H. ; Weiss, L.E. ; Reed, M.L.

Author_Institution

Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

1991

Firstpage

974

Lastpage

977

Abstract

Optimization of the design of a micromechanical surface fastening system is discussed based on a simple cantilevered beam model. Theoretical estimates indicate that the bonding strength of these microstructures can be as high as 11-17 MPa, or 1500-2000 psi. The equivalent surface energy corresponding to the stored strain energy during separation of two interlocked sample pairs is 14.6 mu J/cm/sup 2/. The authors also report preliminary experimental results; a bonding strength of 1.1 MPa or 160 psi per unit interlocked area has been achieved, which is in agreement with the theoretical approximation.<>

Keywords

adhesion; electric sensing devices; integrated circuit technology; microassembling; micromechanical devices; semiconductor technology; surface treatment; Si wafers; bonding strength; cantilevered beam model; design; equivalent surface energy; interlocked sample pairs; micromechanical surface fastening system; modeling; optimisation; stored strain energy; wafer bonding; Application software; Biological materials; Bonding; Failure analysis; Micromechanical devices; Shearing; Stress; Structural beams; Surface resistance; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-87942-585-7

Type

conf

DOI

10.1109/SENSOR.1991.149053

Filename

149053