Title :
On-chip decoupling zone for package-stress reduction
Author :
Spiering, V.L. ; Bouwstra, S. ; Spiering, R.M.E.J. ; Elwenspoek, M.
Author_Institution :
Twente Univ., Enschede, Netherlands
Abstract :
The authors report the reduction of package stresses by introducing a decoupling zone directly around a sensor structure. Different geometries of the decoupling zones are compared, using the finite element method (FEM) and analytical models. Reduction factors over 1000 and higher can be realized by using an axisymmetrical V-corrugation. A design rule to optimize the reduction for the V-corrugation is given. This rule is based on analytical calculations and verified by FEM-simulations. Finally, it is shown that the thickness of a backplate, mounted to the sensor chip, can be optimized for minimal thermal stresses in the sensor.<>
Keywords :
electric sensing devices; finite element analysis; integrated circuit technology; micromechanical devices; optimisation; packaging; semiconductor technology; thermal stresses; axisymmetrical V-corrugation; backplate; design rule; finite element method; micromechanical sensors; minimal thermal stresses; on-chip decoupling zone; optimisation; package-stress reduction; sensor structure; thickness; Actuators; Analytical models; Electronics packaging; Geometry; Mechanical engineering; Mechanical sensors; Micromechanical devices; Proposals; Silicon; Thermal stresses;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.149055
