Title :
High aspect ratio TSVs in micropin-fin heat sinks for 3D ICs
Author :
Dembla, Ashish ; Zhang, Yue ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (35 μm) and high aspect ratio (20:1) TSVs integrated in a benchmarked micropin-fin heat sink capable of removing power density of 100 W/cm2/tier at a junction temperature below 50 °C.
Keywords :
heat sinks; integrated circuit design; integrated circuit interconnections; three-dimensional integrated circuits; 3D IC; benchmarked micropin-fin heat sink; electrical interconnect network; heat removal mechanism; high aspect ratio TSV; high performance 3D systems; power density removal; systematic codesign; Fluid flow measurement; Heat engines; Heat sinks; Heating; Integrated circuits; Lead; Performance evaluation;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-4673-2198-3
DOI :
10.1109/NANO.2012.6322214
