DocumentCode
160519
Title
A temperature gradient based routing algorithm on 3D NoC
Author
Gaoming Du ; Xin Liu ; Yunkun Song ; Duoli Zhang ; Yanghao Ou ; Miao Li
Author_Institution
Inst. of VLSI Design, Hefei Univ. of China, Hefei, China
fYear
2014
fDate
11-13 July 2014
Firstpage
1
Lastpage
5
Abstract
3D NoC has the advantages of low communication delay, low power consumption and high data throughput, but, at the same time, suffers from heat dissipation problem. We propose the concept of temperature gradient as the basis for 3D NoCs routing. By monitoring the temperature of every node, the run-time temperature management (RTM) can calculate the temperature gradient map, and the routing decision can be made by choosing the coolest path for routing. Experiments show that the proposed approach has not only has shorter packet delay (17% improvement) and higher throughput (19.2% improvement), but also lower average temperature (decreased by 2.81oK) than the Edge routing algorithm.
Keywords
cooling; network routing; network-on-chip; three-dimensional integrated circuits; 3D NoC; communication delay; edge routing algorithm; heat dissipation problem; power consumption; run-time temperature management; temperature gradient based routing algorithm; Delays; Load modeling; Routing; Temperature distribution; Temperature sensors; Three-dimensional displays; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Computing, Communication and Networking Technologies (ICCCNT), 2014 International Conference on
Conference_Location
Hefei
Print_ISBN
978-1-4799-2695-4
Type
conf
DOI
10.1109/ICCCNT.2014.6963120
Filename
6963120
Link To Document