• DocumentCode
    160519
  • Title

    A temperature gradient based routing algorithm on 3D NoC

  • Author

    Gaoming Du ; Xin Liu ; Yunkun Song ; Duoli Zhang ; Yanghao Ou ; Miao Li

  • Author_Institution
    Inst. of VLSI Design, Hefei Univ. of China, Hefei, China
  • fYear
    2014
  • fDate
    11-13 July 2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    3D NoC has the advantages of low communication delay, low power consumption and high data throughput, but, at the same time, suffers from heat dissipation problem. We propose the concept of temperature gradient as the basis for 3D NoCs routing. By monitoring the temperature of every node, the run-time temperature management (RTM) can calculate the temperature gradient map, and the routing decision can be made by choosing the coolest path for routing. Experiments show that the proposed approach has not only has shorter packet delay (17% improvement) and higher throughput (19.2% improvement), but also lower average temperature (decreased by 2.81oK) than the Edge routing algorithm.
  • Keywords
    cooling; network routing; network-on-chip; three-dimensional integrated circuits; 3D NoC; communication delay; edge routing algorithm; heat dissipation problem; power consumption; run-time temperature management; temperature gradient based routing algorithm; Delays; Load modeling; Routing; Temperature distribution; Temperature sensors; Three-dimensional displays; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computing, Communication and Networking Technologies (ICCCNT), 2014 International Conference on
  • Conference_Location
    Hefei
  • Print_ISBN
    978-1-4799-2695-4
  • Type

    conf

  • DOI
    10.1109/ICCCNT.2014.6963120
  • Filename
    6963120